G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive SEMI M57 — Guide for

SEMI M57 — Guide for Specifying Silicon Annealed Wafers

SEMI E62-0302AE (editorial revision)

SEMI D25 ¾ Specification for Flat Panel Display Substrate Shipping Case

参考までに，米国で通常使われている単位が2インチおよび3インチウェーハには用いられ，SI（メートル）単位が100 mm以上のウェーハには使われている。

the absorption band peak is at 607

G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive SEMI M57 — Guide forNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line tool makers as the