G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly StdTpc-Stainless Steel Components SEMI MF110-1105 (technical revision)

SEMI MF110-1105 (technical revision)

·        プロセスカセットまたはクォーツボートとプロセスチェンバーの底面との間

SEMI T19 — Specification for Device Marking

org August 2000

process flows

G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly StdTpc-Stainless Steel Components SEMI MF110-1105 (technical revision)This specification provides guidelines for the design and acceptance of metal lid preform assemblies. This specification may be used by suppliers at outgoing inspection and by the customers at incoming inspection. The design and acceptance criteria may be used for metal lid preform assemblies used on all types of semiconductor packages. Improper lid preform design and poorly specified lid preforms contributes to low sealing yields and unreliable