MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Revision:SEMI MS12-0220 (Reapproved 1125) - Current SEMI E172-0225 (technical revision)

SEMI E172-0225 (technical revision)

SEMI P38 — Specification for Absorbing Film Stacks and Multilayers on Extreme Ultraviolet Lithography Mask Blanks

and Bricks Using an Eddy-Current Sensor

Secondary ion mass spectrometry (SIMS) can measure on polished silicon wafer product the following:

·    Film deposition equipment (CVD & PVD)

MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Revision:SEMI MS12-0220 (Reapproved 1125) - Current SEMI E172-0225 (technical revision)1 Purpose 1. 1 Although the substrates used in the production of MEMS share many physical and electrical properties with those used in IC manufacturing there are some significant differences as well. There exists a need to standardize MEMS substrates to allow the stocking of standard material, lowering the time to purchase, time to market and overall cost. This specification provides the necessary information for ordering and specifying such