G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdTpc-Minienvironments to be published February 2000

to be published February 2000

6-1103 (Reapproved 1211)

SEMI MF1388-0707 (technical revision)

The test method is applicable to circular silicon wafers from 50 mm (or 2

This Document provides a common basis for communication between manufacturers and users

G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdTpc-Minienvironments to be published February 2000This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1986; previously published in 1988. NOTICE: This Document was reapproved with minor editorial changes. The purpose of this test is to determine the thermal