M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness StdPbc-0912 SEMI E80-0299 (first published)

SEMI E80-0299 (first published)

Measurements made at the three positions specified in this Guide do not provide complete information about the roundness of the wafer

Such impurities may be introduced into the wafer during manufacture or during various processing steps

buffer oxide etchants

In addition to the interviews

M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness StdPbc-0912 SEMI E80-0299 (first published)Wafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer to determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable quantifying the near edge geometry of wafers used in semiconductor device processing. The PSFQR or PSFQD metric is suitable for quantifying near edge