MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded This Standard covers the domain

This Standard covers the domain of semiconductor manufacturing equipment operation

SEMI G4-89 (technical revision)

これらの方法は，薬品とFPD製造で実際に使用されている条件を用いてカラーフィルタの耐薬品性を試験するものである。

システム中にあるマテリアルについてその所在位置およびその搬送履歴を記録し報告する。

and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded This Standard covers the domain1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide