P04700 - SEMI P47 - ラインエッジラフネス（Line Edge Roughness）およびライン幅ラフネス（Line Width Roughness）測定の試験方法 StdPbc-0218 It has become increasingly important

It has become increasingly important in semiconductor material and device manufacturing to describe

and Safety Guideline for Semiconductor Manufacturing EquipmentSEMI S4 — Safety Guideline for the Separation of Chemical Cylinders Contained in Dispensing CabinetsSEMI S5 — Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder ValvesSEMI S6 — Environmental

equipment and testing to ensure an unified terminology for this technology

The source is normally a polarized laser beam in combination with a high-contrast prism polarizer

orgで入手可能となる。前版は2012年4月発行。

P04700 - SEMI P47 - ラインエッジラフネス（Line Edge Roughness）およびライン幅ラフネス（Line Width Roughness）測定の試験方法 StdPbc-0218 It has become increasingly importantglobal Microlithography Committee20061121global Audits and Reviews Subcommittee20072www. semi. org20073CD ROM IC Referenced SEMI Standards SEMI P19 Specification for Metrology Pattern Cells for Integrated Circuit Manufacture SEMI P35 Terminology for Microlithography Metrology SEMI P36 Guideline of Magnification Reference for Critical Dimension Measurement Scanning Electron Microscopes