G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current odorless and oxidizing gas

odorless and oxidizing gas

Manufacturing equipment upgrade and support tasks

The final goal of the Standard is to realize the traceability of semiconductor

org September 2003

SEMI E148 — Specification for Time Synchronization and Definition of the TS-Clock Object

G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current odorless and oxidizing gasMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The characteristics