Thermocouple on PCB, K1 (for MC302/302N) (HLH200-2000COM) EZFLUX-500

Thermocouple on PCB, K1 (for MC302/302N) (HLH200-2000COM) EZFLUX-500

The MC385V2V offers a flexible placement area that adapts to different feeder configurations

distributors

Main wave: smooth drainage prevents bridging

while an intelligent conveyor automatically adjusts to each job

0 mm ID Round Nozzle for Ultima Model Selective Soldering Machines

it quickly heats up using high-speed PID to control temperature output

The SDM223 uses a precision dual-blade design to maintain alignment and consistent cutting depth throughout the depaneling process

Fuse Presence

Flexible Capacity and Speed Control

The MX1 detects hidden BGA defects including missing balls

supporting oversized boards and panelized designs across a wide range of applications

This system is ideal for high-mix or transitioning production environments