C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current noncluster tools

noncluster tools

then defining MPCT performance as a function of IPS performance

設備在設計上應符合使用者預期的操作方式，以期將錯誤及事故機率降至最低。

設備使用者文件的一般標準

SEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe

C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current noncluster toolsThis Document will provide a guide for the measurements of and reporting of more accurate parameters of hardness of chemical mechanical planarization (CMP) pads, than current industry standards. This Document will provide a guide for the measurement of and reporting of effect of the temperature on the pad hardness. Reference to this Guide can be used in the corresponding certificate of acceptance (CoA) from a CMP supplier to its customers. Reference