G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI T11-0703 (Reapproved 0921)

SEMI T11-0703 (Reapproved 0921)

NOTICE: This Document was completely rewritten in 2008

focusing on real world rather than algorithm development

This Specification covers requirements for all grades of dichlorosilane (SiH2Cl2) used in the semiconductor industry

Topic & Readings

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title SEMI T11-0703 (Reapproved 0921)This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.