G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded EQIPs may be defined for

EQIPs may be defined for a new equipment type not previously addressed in this Standard

and micro-bump are developed to ensure high-yield of the middle-end process

1  The purpose of this Standard is to standardize requirements for ammonium hydroxide used in the semiconductor industry and testing procedures to support those standards

The GEM Standard defines which SECS-II messages should be used

in order to control particulate contamination from those gases

G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded EQIPs may be defined forThis Test Method defines a procedure for the evaluation of die strength by the mean of 3 point bending method. This Test Method applies only for 3 point bending method, and other methods will be defined by the separate documents. This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and