G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages StdPbc-1111 org in November 2016

org in November 2016

high-resolution mechanical stylus systems

and to verify ongoing compliance as a part of factory maintenance procedures

the recombination characteristics must be carefully controlled to obtain the desired device performance

processing

G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages StdPbc-1111 org in November 2016NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. The purpose of this Test Method is to determine the thermal resistance of integrated circuit packages using thermal test chips. This Test Method deals only with junction to ambient measurements of thermal resistance and