M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical SEMI M62-0309 (technical revision)

SEMI M62-0309 (technical revision)

This Document covers requirements for carbon tetrafluoride (CF4) used in the semiconductor industry

This Specification provides common characteristics of Ag paste based on currently widely used for photovoltaic applications

SEMI MF1727-1110 (technical revision)

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M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical SEMI M62-0309 (technical revision)This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www. semi. org in October 2010. Originally published November 2001. NOTICE: This document was balloted and approved for withdrawal in 2010. The purpose of this document is to provide a guide for evaluation of chemical mechanical polishing (CMP)