E14200 - SEMI E142 - Specification for Substrate Mapping StdTpc-Silicon on Insulator The precision that can be

The precision that can be expected depends on both the resistivity of the wafer and on the homogeneity of the wafer

This Standard specifies the testing procedures and test equipment required for the following:

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This Standard was technically approved by the Flat Panel Display – Materials & Components Global Technical Committee

These test methods apply to liquid chemical and UPW system components intended for use in semiconductor manufacturing tools and ancillary equipment

E14200 - SEMI E142 - Specification for Substrate Mapping StdTpc-Silicon on Insulator The precision that can be1 Purpose 1. 1 This Specification defines the data items that are required to report, store, and transmit map data for substrates such as wafers, frames, strips, and trays. 2 Scope 2. 1 This version of the Specification applies to the substrate types: wafers, frames, strips, and trays. 2. 2 This Specification addresses assembly and packaging including the testing of semiconductor devices. Subordinate Standards (included) SEMI E142. 1 Specification for