Advanced Packaging including Heterogeneous Integration & Chiplets 6/8 ElnTpc-Safety - Facility/Workplace Silicon technology underlies the integrated

Silicon technology underlies the integrated circuit and device industry

and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers

Significant security requirements (e

1 The purpose of this Specification is to define a secure

2-0621 (Reapproved 0925)

Advanced Packaging including Heterogeneous Integration & Chiplets 6/8 ElnTpc-Safety - Facility/Workplace Silicon technology underlies the integratedAdvanced Packaging incl. Heterogeneous Integration & Chiplets Dates & Times June 8th June 9th 7: 30 11: 30 PT Early Bird Pricing $100 off Member $845 $745 Non Member $ 945 $845 Location Virtual This one day course addresses IC packaging, assembly, and package substrate and Heterogeneous Integration & Chiplets. It stresses the impact of the IC and end product requirements, i. e., smaller, better, cheaper and their influence on the manufacturing