Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working Removed from a Hitachi MU-712E

Removed from a Hitachi MU-712E Shallow Trench Etcher System

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CE Marked This GE Fanuc CQPICTDE0000-A Panel PC is used working surplus

5080-193409-11: SPACER TK006-01-038-0 (Qty

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Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working Removed from a Hitachi MU-712ERudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.