G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control and description of the SECS-II

and description of the SECS-II messages

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and their interchangeability at all mechanical interfaces

4  Because no chuck is used as a measurement reference

This Document applies only to hydrogen gas delivered through pipelines

SEMI F78-0703 (first published)

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control and description of the SECS-IIThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a