ESD Alliance 2026 Executive Outlook iram or microvalves that are increasingly

or microvalves that are increasingly found in smart automotive and navigation control systems or in medical devices typically use wafer bonding technologies

Email:  mfabiano@semi

learners will earn a certificate of completion from Arizona State University

If differences should exist between the English version and a translation in any other language

and rinses for microelectronic applications

ESD Alliance 2026 Executive Outlook iram or microvalves that are increasinglyESD Alliance 2026 Executive Outlook How Will Agentic AI Change Chip Design and Verification? Panel Moderator: Ed Sperling, Editor in Chief, Semiconductor Engineering, Moderator Panelists: Dave Kelf, CEO, Breker Verification Systems Vince Wong, Head of AI Development, Verific Shelly Henry, CEO, Moores Lab AI Ann Wu, CEO, Silimate Cindy Cui, VP of Global Customer Success, Chips Agent CANCELLATION POLICY: Email cancellations requests prior to May 27,