Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD SiC-4H film on SiC-4H Mobility: 3710-6230cm^2/V

Mobility: 3710-6230cm^2/V

Thickness = 1

Chemical Composition Ni (mol%) 90

One piece of 12123 top cover

For continuous heating above 800 ºC

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD SiC-4H film on SiC-4H Mobility: 3710-6230cm^2/VEQ ECO 419 LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2. 0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck. SPECIFICATIONS: Width 6. 5" Thickness 0. 25mm Length Price sold by 10 feet per quantity Item It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing. Application Notes