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Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra Prismatic Cell Capable for KSL-1650X-GS65 furnace
Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra Prismatic Cell Capable for KSL-1650X-GS65 furnace
$102.35
Description
Capable for KSL-1650X-GS65 furnace
The micrometer head's controllable accuracy is ~10 microns
Doping: Ga-doped
)): 109 - 1011
single phase Compress Air Pressure Requirement 0
Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra Prismatic Cell Capable for KSL-1650X-GS65 furnaceSpecifications: Wafer Size: 5mmx5mmx0. 5mm Silicon wafer Orientation: (100) + 0. 5o Diamond film thickness: 2 micron Resistivity: 10E3 ~ 10E4 ohm cm Surface roughness: one sides CMP polished with surface roughness < 10 nm Package: One 1000 class clean room with 100 class plastic bag
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
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- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
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