Cu Metallic Substrate ( polycrystalline) 10x10x1.0mm, 1 side polished CsI(Tl) Tighten the Quick Connect to
$52.84
Description
Tighten the Quick Connect to fix the position of the Sputtering head
Diameter: 100mm +/- 0
2500 ~ 3500
Holder Material: Polypropylene
quick connector
Cu Metallic Substrate ( polycrystalline) 10x10x1.0mm, 1 side polished CsI(Tl) Tighten the Quick Connect toCu Metallic Substrate ( polycrystalline) Purity: 99. 99% (Oxygen < 70 ppm) Size: 10x10x1. 0 mm Orientation: N A Surface finish (RMS or Ra) : One side polished < 100A Packing: in 1000 class cleanroom with vacuumed bag Application: substrates for metal, alloy film and biological materials
Shipping Notes
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