4"Dia x 0.35 mm x0.5" arbor Alumina Abrasive Cutting Blade For Low Speed / Trim Saw - EQ-AL0404 Refractory Materials W: 3

W:      3

IF length:     8

A plane  (11-20) sapphire wafer  is being used extensively as a substrate for III-V nitrides and magnetic epitaxial films due to its better lattice mismatch

Net Weight 11

Alligator configuration (two small clamps for voltage and two big clamps for current) can be used with MTI's battery analyzers and other vendor's testing system

4"Dia x 0.35 mm x0.5" arbor Alumina Abrasive Cutting Blade For Low Speed / Trim Saw - EQ-AL0404 Refractory Materials W: 3MTI supplies high quality hot pressed Alumina cutting blades with 4" diameter x 0. 35 mm thickness and 0. 5" arbor. Compared with diamond blade, alumina cutting blade provides better cutting rate to cut metallic material at much lower cost, especially for cutting ferrous metal samples, such as carbon steel, cast iron, and spring steel etc. The Alumina cutting blade fits with MTI SYJ 150 low speed saw or other brand of low speed saw. Specification: