+ 0. 5 o Wafer size: 2" dia x 0. 4 0. 5 mm thickness Polished surface: Two sidesEPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth Technique: CZ Crystal Purity: >99."> + 0. 5 o Wafer size: 2" dia x 0. 4 0. 5 mm thickness Polished surface: Two sidesEPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth Technique: CZ Crystal Purity: >99."> + 0. 5 o Wafer size: 2" dia x 0. 4 0. 5 mm thickness Polished surface: Two sidesEPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth Technique: CZ Crystal Purity: >99."> Al2O3-Sapphire Wafer, M-plane, 1"Dia x 0.5 mm, 2SP - ALM25D05C2 Battery Cell Tester 48"x40"x40" Compliance CE Certified Warranty – surdyk.pl

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Al2O3-Sapphire Wafer, M-plane, 1"Dia x 0.5 mm, 2SP - ALM25D05C2 Battery Cell Tester 48"x40"x40" Compliance CE Certified Warranty

$149.44

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48"x40"x40" Compliance CE Certified Warranty The pressing machine was quality inspected in the USA

Working temperature: 1750°C in air (short time)

Please clean with alcohol if cleaning is needed

Optional vacuum SS304 Jar

saving the user's time and cost

Al2O3-Sapphire Wafer, M-plane, 1"Dia x 0.5 mm, 2SP - ALM25D05C2 Battery Cell Tester 48"x40"x40" Compliance CE Certified WarrantySpecifications: Orientation: M <10 10> + 0. 5 o Wafer size: 2" dia x 0. 4 0. 5 mm thickness Polished surface: Two sidesEPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth Technique: CZ Crystal Purity: >99.

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