Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-232773 The aim of the round-robin

The aim of the round-robin test was to establish a test method that could meet the requirement of ISO 20643 for measurement of vibration emissions in three directions

Definitions have been brought into line with 60050-841:2004

including heat treatment

Manufacturers of high temperature mica plate and alumina ceramics

types of UMF voltage ratings and temperate

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-232773 The aim of the round-robinWhat is BS EN 61191 6 Evaluation of voids in BGA and LGA soldered connections about? BS EN 61191 6 is the sixth part of a multi series standard used for Printed board assemblies that specifies the measuring methods for voids in soldered joints of BGA and LGA. BS EN 61191 6 is useful in evaluating these voids that results in manufacturing good quality printed boards. BS EN 61191 6 specifies the evaluation criteria for voids on the scale of the thermal