LaAlO3, (100) orn. 1"x 1" x 0.5mm substrate , 2 side epi polished - LAOa252505S2US Diamond on Silicon wafer Diamond Scriber for Cutting Single

Diamond Scriber for Cutting Single Crystal Substrate

Surface Roughness:  < 10A

Air-lock Chamber Dimensions: 200mm(ID) x 232mm(L)

PVDF: 3wt%]

Li2CO3 (%) 0

LaAlO3, (100) orn. 1"x 1" x 0.5mm substrate , 2 side epi polished - LAOa252505S2US Diamond on Silicon wafer Diamond Scriber for Cutting SingleLaAlO3 single crystal provides a good lattice match to many materials with perovskite structure. It is an excellent substrate for the epitaxial growth of high Tc superconductors and magnetic and ferroelectric thin films. The dielectric properties of LaAlO3 crystal are well suitable for low loss microwave and dielectric resonance applications. Substrate Specifications: Wafer Size: 1'' x 1'' x 0. 5 mm thickness + 0. 05 mm, Wafer Orientation: (100) + 0.