+ 0. 5 Dimension: 1" x 0. 26 + 0. 03 mm Polished: One side epi polished Surface Roughness: < 5 A by AFM Typical Properties of Single Crystal SiC Formula weight: 40. 10 Unit Cell: Hexagonal Lattice constant: a =3. 07 A c = 10. 53 A Stacking sequence: ABCB (4H) Growth Technique: MOCVD Polishing : Silicon face polished Band Gap: 3. 26eV ( Indirect) Conductivity type: N TTV Bow Warp: <=35 um Micropipe"> + 0. 5 Dimension: 1" x 0. 26 + 0. 03 mm Polished: One side epi polished Surface Roughness: < 5 A by AFM Typical Properties of Single Crystal SiC Formula weight: 40. 10 Unit Cell: Hexagonal Lattice constant: a =3. 07 A c = 10. 53 A Stacking sequence: ABCB (4H) Growth Technique: MOCVD Polishing : Silicon face polished Band Gap: 3. 26eV ( Indirect) Conductivity type: N TTV Bow Warp: <=35 um Micropipe"> + 0. 5 Dimension: 1" x 0. 26 + 0. 03 mm Polished: One side epi polished Surface Roughness: < 5 A by AFM Typical Properties of Single Crystal SiC Formula weight: 40. 10 Unit Cell: Hexagonal Lattice constant: a =3. 07 A c = 10. 53 A Stacking sequence: ABCB (4H) Growth Technique: MOCVD Polishing : Silicon face polished Band Gap: 3. 26eV ( Indirect) Conductivity type: N TTV Bow Warp: <=35 um Micropipe"> SiC - 4H (0001), 1" dia. x0.26 mm th., one side polished - SC4Hz25D026C1US ITO Coated Plastic Film Die Set & Compatibility – surdyk.pl

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SiC - 4H (0001), 1" dia. x0.26 mm th., one side polished - SC4Hz25D026C1US ITO Coated Plastic Film Die Set & Compatibility

$321.32

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Die Set & Compatibility

ID:      230 mm

Total Thickness: ~83 um

Please contact MTI for mullite

Two needle valves allow you control air flow pressure and its splittable design provides you the most convenient way to test various anode and cathode materials

SiC - 4H (0001), 1" dia. x0.26 mm th., one side polished - SC4Hz25D026C1US ITO Coated Plastic Film Die Set & CompatibilitySpecifications of Substrate Orientation: <0001> + 0. 5 Dimension: 1" x 0. 26 + 0. 03 mm Polished: One side epi polished Surface Roughness: < 5 A by AFM Typical Properties of Single Crystal SiC Formula weight: 40. 10 Unit Cell: Hexagonal Lattice constant: a =3. 07 A c = 10. 53 A Stacking sequence: ABCB (4H) Growth Technique: MOCVD Polishing : Silicon face polished Band Gap: 3. 26eV ( Indirect) Conductivity type: N TTV Bow Warp: <=35 um Micropipe

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