or <100>"> or <100>"> or <100>"> GaP Wafer, S doped (111) 2"x0.5 mm, 2sp - GPSc50D05C2 TGA Binder: Modified acrylate adhesive (water – surdyk.pl

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GaP Wafer, S doped (111) 2"x0.5 mm, 2sp - GPSc50D05C2 TGA Binder: Modified acrylate adhesive (water

$344.43

Quantity
Description

Binder: Modified acrylate adhesive (water based)

Dimensions

Digital pressure Gauge ( 60Mpa ) with Alarm  is available upon request ( Click picture to see specs & cost)

The crimper is driven by compressed inert gas or air for various types of coin cells such as CR2016

which will help prevent damages and prolong the integrity of the material

GaP Wafer, S doped (111) 2"x0.5 mm, 2sp - GPSc50D05C2 TGA Binder: Modified acrylate adhesive (waterGaP single crystal wafer, Size: 2" diameter(+ _0. 15mm) x 0. 5mm(+ _ 0. 05mm), Doping: S doped, Conducting type: N type, Orientation: (111)+_30' Edge Orientation: (110)1 Polished: Both sides polished. Surface finish (RMS or Ra) : < 8A Typical Physical Properties Crystal Structure Cubic. a =5. 4505 ?3 Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100>

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