Bambu Lab AP Board Cover - H2D bondtech BMG extruder Pairs perfectly with the Voron
$19.99
Description
Pairs perfectly with the Voron StealthBurner
Filament Normal PA6-CF Bambu PA6-CF Bambu PAHT-CF Bambu PPA-CF Stiffness (Bending Modulus - XY
Snapmaker Luban 4-axis software support
Great for simple circuitry and interactive projects
- 2 mm hex key
Bambu Lab AP Board Cover - H2D bondtech BMG extruder Pairs perfectly with the VoronOverview Covers and protects the AP board from dust and damage. Installation Learn more about AP Board Cover on Bambu Lab Wiki. In the Box AP Board Cover*1 Cable Tray Cover*1 BT2. 6 8 Screw*1 Compatibility H2D and H2D Laser Product Specifications Materials Plastic Packaging Size 122*122*262 mm Color Black Packaging Weight 0. 186 kg
Shipping Notes
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