Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials Ingestion-build-264231 Alternative precautions may be required

Alternative precautions may be required in clean rooms of ISO 14644-1 class 5 or less if contamination is formed as a result of using the procedures specified in this standard

Characteristics of Image Acquisition

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The crypto suite is defined in alignment with existing air interfaces

Contents of technical file

Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials Ingestion-build-264231 Alternative precautions may be required1 Scope This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 m and 10 m. Thin films are used as main structural materials for Micro electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material