Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-105964 pressing or other suitable techniques

pressing or other suitable techniques

Contents of BS EN ISO 10993-5 include:

Pile-up generally occurs for fully work-hardened materials

BS EN 60512-27-100 on assessing the transmission performance of connectors is useful for:

equivalent bending stiffness

Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-105964 pressing or other suitable techniques1 Scope This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the