InSb (100) 2" dia x 0.5 mm, N type Undoped, 2 sides polished Additive A thermal block must be

A thermal block must be placed at the end of the furnace to reduce heat radiation

click the picture below to see how to install

Doped with Fe

Regular sealing gasket and Nylon body are default choice for the pressure cell

Polish:             two sides EPI polished with surface roughness  Ra< 5 A

InSb (100) 2" dia x 0.5 mm, N type Undoped, 2 sides polished Additive A thermal block must be2" InSb wafer (N type, Undoped ) Size: 2" dia x 0. 5 (+ 0. 025 ) mm thick Orientation: <100> + 0. 5 o Type dopant: N type Undoped Surface Polishing : In(A) face polished chemical ,final face Sb(B) face polished Linde A0. 3um ( mirror finish) Mobility: > 3. 9E4 cm^2 V. S EPD: < 200 Carrier Concentration: (2 7)E14 cm 3@77K Growth Method: LEC Packing: Sealed in nitrogen in single wafer container at 100 class clean room