99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Pressing Die 1/8" - 3" – surdyk.pl

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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Pressing Die 1/8" - 3"

$744.62

Quantity
Description

Pressing Die  1/8" - 3"

Laser Mark: none

76 Array (Capacity):  6*6 =36

67mm  Height    = 3

600 lbs loading

BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Pressing Die 1/8" - 3"Composition: Bismuth Iron Oxide BiFeO3 Target 3" Dia x 0. 125" Thick bond to Copper(Cu) backing plate(0. 111" thick) Purity: > 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater

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